Features:
Dual-Axis 360° Rotation: Features smooth dual-axis ball bearings, allowing you to rotate the motherboard to any desired angle (horizontal/vertical) effortlessly. This provides optimal viewing and access during intricate repair work.
High-Temperature Resistance: Made with premium materials that can withstand prolonged exposure to heat from hot air guns, preventing melting or deformation during BGA rework.
Secure & Scratch-Free Clamping: Equipped with adjustable and reinforced clamps with protective pads. They hold various sizes of mobile motherboards (for iPhone, Samsung, etc.) firmly in place without causing any scratches or damage.
Precise BGA Alignment: The stable and level platform is crucial for the accurate placement of BGA chips, significantly increasing the success rate of chip reballing and replacement.
Universal Compatibility: Designed to accommodate most smartphones’ motherboards, making it an essential all-in-one tool for every professional repair shop.
Warm Tip :
1. If the item is damaged or any problems, please contact us immediately before leaving feedback and we’ll do our best to solve your problem as soon as possible!
2. Due to manual measurement, the size may have an error of 1-2cm.
