1.10DOF modules (three-axis gyroscope + triaxial accelerometer + three-axis magnetic field + Pressure).

2.Immersion Gold PCB process.

3.Using the chip: MPU6050 + HMC5883L + BMP180.

4.Power supply :3-5v.

5.Means of communication: IIC communication protocol (fully compatible with 3-5v system containing LLC circuit).

6.Size: 2.2cm * 1.7cm.